Brief: Discover the TIF400 Thermal Pad, a high-performance 2W/MK silicon thermal pad designed for telecommunication hardware. This yellow thermal gap pad offers excellent thermal conductivity, moldability, and low-stress applications. Perfect for RDRAM memory modules, automotive engine control units, and more.
Related Product Features:
Buena conductividad térmica con un rendimiento de 2.0 W/mK.
Moldeable para piezas complejas y espacios reducidos.
Soft and compressible for low-stress applications.
Naturally tacky, eliminating the need for adhesive coatings.
Disponible en varios espesores de 0,5 mm a 5,0 mm.
Electrically isolating material for high-voltage applications.
UL94 V-0 flame rating for safety compliance.
Adecuado para el hardware de telecomunicaciones y los dispositivos iluminados por LED.
Las preguntas:
What is the thermal conductivity of the TIF400 Thermal Pad?
The TIF400 Thermal Pad has a thermal conductivity of 2.0 W/mK, making it highly effective for heat dissipation.
Can the TIF400 Thermal Pad be used in high-voltage applications?
Yes, the TIF400 is an electrically isolating material, making it suitable for high-voltage, bare-leaded devices.
What thickness options are available for the TIF400 Thermal Pad?
The TIF400 is available in thicknesses ranging from 0.5mm to 5.0mm, with standard and custom options upon request.