Brief: Discover the TIC™800P Series PCM Phase Change Material, designed for communications equipment and wireless stations. This pink thermal interface material softens at 50℃, reducing thermal resistance with no performance degradation after 1,000 hours at 130℃. Ideal for CPUs, display cards, and more.
Related Product Features:
Low melting point thermal interface material that softens at 50℃ to fill microscopic irregularities.
Sólido flexible a temperatura ambiente sin componentes de refuerzo para un rendimiento térmico óptimo.
Sin degradación del rendimiento térmico después de 1.000 horas a 130℃ o 500 ciclos de -25℃ a 125℃.
Naturally tacky at room temperature, eliminating the need for adhesives.
Thermal resistance of 0.024℃-in²/W for efficient heat dissipation.
Disponible en espesores estándar de 0.005", 0.008" y 0.010".
Suitable for applications like CPUs, display cards, and power supplies.
Comes with white release paper and bottom liner for easy handling.
Las preguntas:
¿Cuál es la temperatura de reblandecimiento de la serie TIC™800P?
La serie TIC™800P comienza a ablandarse a 50℃, lo que le permite rellenar irregularidades microscópicas para reducir la resistencia térmica.
Does the TIC™800P Series require adhesives?
No, the material is naturally tacky at room temperature, so no adhesives are required.
What are the typical applications for the TIC™800P Series?
The TIC™800P Series is ideal for CPUs, display cards, mainboards, notebooks, power supplies, heat pipe thermal solutions, memory modules, and mass storage devices.