PHASE CHANGE MATERIAL TIC800P

相变化
April 13, 2021
Conexión De Categoría: Material del cambio de fase del PCM
Brief: Discover the Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules, ideal for high-performance thermal management in electronics. With excellent thermal conductivity and durability, these modules are perfect for microprocessors, memory modules, and more.
Related Product Features:
  • Baja resistencia térmica de 0,014 °C-in2/W para una disipación de calor eficiente.
  • Naturally tacky at room temperature, eliminating the need for adhesives.
  • No heat sink preheating required, simplifying installation.
  • Durable performance with no degradation after 1,000 hours at 130℃.
  • Available in multiple thicknesses: 0.005”, 0.008”, 0.010”, and 0.012”.
  • Thermal conductivity of 5.0 W/mK for superior heat transfer.
  • Suitable for a wide temperature range from -25℃ to 125℃.
  • Independiente y flexible, sin necesidad de componentes de refuerzo.
Las preguntas:
  • What is the phase change softening temperature of the TIC™800G Series?
    The TIC™800G Series begins to soften and flow at 50℃ to 60℃, filling microscopic irregularities for reduced thermal resistance.
  • Can the TIC™800G Series be used without adhesive?
    Yes, the material is naturally tacky at room temperature, so no adhesive is required for installation.
  • What applications are suitable for the TIC™800G Series?
    It is ideal for high-frequency microprocessors, notebooks, desktop PCs, memory modules, cache chips, and IGBTs.
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