Name: Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-32-05U
Price: 4.10 USD
Availability: InStock

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Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Datos del producto:

Lugar de origen:	Porcelana
Nombre de la marca:	Ziitek
Certificación:	UL & RoHS
Número de modelo:	TIF100-32-05U

Pago y Envío Términos:

Cantidad de orden mínima:	1000 piezas
Precio:	0.1-10 USD/PCS
Detalles de empaquetado:	cajas de 242312 cm
Tiempo de entrega:	3-5 días laborables
Condiciones de pago:	T/T
Capacidad de la fuente:	1000000 PC/mes

Contacto

Descripción detallada del producto

Nombre de los productos:	Almohadilla de silicona térmica ultrasuave, relleno de huecos de alta conductividad de 3,2 W para se	Rango de espesor:	0,25-5,0 mmT
Aplicación:	Servidores AI, refrigeración GPU, inversor	Color:	Azul
Tensión de ruptura (V/mm)):	≥5500	Construcción:	Elastómero de silicona lleno de cerámica
Calificación de fuego:	UL94 V-0	Conductividad térmica:	3.2W/m-K
Constante dieléctrica @1MHz:	3.5	Palabras clave:	Almohadilla térmica de silicona

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

The TIF^®100-32-05U Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assemblies.

Features:

> Good thermal conductivity: 3.2W/mK

> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability

Applications

> AI Servers, Inverters, Telecom Devices

> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems

> Display card
> Mainboard/mother board
> Notebook

> Power supply
> Heat pipe thermal solutions

Typical Properties of TIF^®100-32-05U Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020 (0.25~0.5)	0.030~0.200 (0.75~5.0)	ASTM D374
Hardness (Shore OO)	65	27	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		***
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	3.5 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.2 W/m-K		ASTM D5470
	3.2 W/m-K		ISO22007

Product Specifications

Standard Thickness: 0.010"(0.25 mm)-0.200" (5.00 mm) with increments of 0.01 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ultra Soft Thermal Silicone Pad 3.2W High Conductivity Gap Filler For AI Servers, GPU Cooling, Inverter 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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