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0.8W/mK Thermal Conductive Insulating Gasket Designed To Provide Thermal Conductivity Of 0.8W/mK For Heat Dissipation In Electronic Devices

0.8W/mK Thermal Conductive Insulating Gasket Designed To Provide Thermal Conductivity Of 0.8W/mK For Heat Dissipation In Electronic Devices

  • 0.8W/mK Thermal Conductive Insulating Gasket Designed To Provide Thermal Conductivity Of 0.8W/mK For Heat Dissipation In Electronic Devices
  • 0.8W/mK Thermal Conductive Insulating Gasket Designed To Provide Thermal Conductivity Of 0.8W/mK For Heat Dissipation In Electronic Devices
0.8W/mK Thermal Conductive Insulating Gasket Designed To Provide Thermal Conductivity Of 0.8W/mK For Heat Dissipation In Electronic Devices
Datos del producto:
Lugar de origen: Porcelana
Nombre de la marca: Ziitek
Certificación: UL and RoHs
Número de modelo: TIS100-08-01F
Documento: TIS100-08-01F_Data Sheet.pdf
Pago y Envío Términos:
Cantidad de orden mínima: 1000 piezas
Precio: 0.1-10 USD/PCS
Detalles de empaquetado: cartón de 24*13*12cm
Tiempo de entrega: 3-8 días laborables
Condiciones de pago: T/T
Capacidad de la fuente: 100000 unidades/mes
Contacto
Descripción detallada del producto
Nombre de los productos: Junta aislante conductora térmica de 0,8 W/mK diseñada para proporcionar una conductividad térmica d conductor termal: 0.8W/mk
Dureza: 60 costas 00 muestra: Muestra gratis
Color: Negro Espesor (pulgadas/mm): 0,012/0,30
Densidad: 1,8 g/cm³ Palabras clave: Junta aislante termoconductora
Construcción: Elastómero de silicona relleno de cerámica Solicitud: Disipación de calor en dispositivos electrónicos

0.8W/mK Thermal Conductive Insulating Gasket Designed To Provide Thermal Conductivity Of 0.8W/mK For Heat Dissipation In Electronic Devices

Products description


The TIS®100-08-01F Series is a high-efficiency thermal conductive insulating product. lt incorporates insulating silicone substrates into thermally conductive materials to achieve both insulation and heat conduction. At the same time, the glass fibers provide excellent tear and puncture resistance. The product is non-toxic and environmentally friendly, has flame-retardant properties, and is mainly used for isolating power supplies and heat sinks.


Features 

>Surface is relatively soft and has good heat conductivity
>Good dielectric strength
>Low thermal resistance with high voltage isolation
>Resistant to tears and punctures

Applications 

>Car battery and power supply
>Power semiconductors
>Audio and video components
>Motor controllers

Key attributes 

Typical Properties of TIS®100-08-01F Series 
Product Model TIS112-08-01F TIS120-08-01F Test method
Color Black Visual
Construction Ceramic filled silicone elastomer/ Fiberglass ******
Density(g/cm³) 1.8 ASTM D792
Thickness Range(inch/mm) 0.012 0.020 ASTM D374
0.30 0.50
Hardness (Shore 00) 60 ASTM 2240
Tensile Strength (Mpa) 21 ASTM D412
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5000 ASTM D149
Dielectric Constant @1MHz 6.0 ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 0.8 W/m-K ASTM D5470
0.8 W/m-K ISO22007


Product Specifications 

 

Standard Thickness: 0.012" (0.30 mm),0.020" (0.50 mm)
Standard Size: 12"X160" (304 mmX48.7M)

0.8W/mK Thermal Conductive Insulating Gasket Designed To Provide Thermal Conductivity Of 0.8W/mK For Heat Dissipation In Electronic Devices 0

Packaging Details & Lead time 

 

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Company profile 


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Factory Size:8000~10,000 square meters

Factory Country/Region:No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).


Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


Independent R&D team 


Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us. 

4. We will reply you as soon as possible with Email or online.

 

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: +86 18153789196

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