Good Insulation Performance 6W/MK Thermal Conductivity Thermal Pad For AI Processors
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
The TIF®600G Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.
Features:
> Good thermal conductivity: 6.0W/mK
> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Easy release construction
> Electrically isolating
> High durability
Applications
> AI Servers, Inverters, Telecom Devices
> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
| Typical Properties of TIF®600G Series |
| Property |
Value |
Test method |
| Color |
Garnet |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.4 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.020~0.030
(0.5~0.75)
|
0.040~0.200 (1.0~5.0) |
ASTM D374 |
| Hardness (Shore OO) |
60 |
45 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
*** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
4.5 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
6.0 W/m-K |
ASTM D5470 |
| 6.0 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.020"(0.50 mm)-0.200" (5.00 mm) with increments of 0.01 0inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010” to 0.020” (0.25mm to 0.50mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Independent R&D team
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
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