Name: High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF500-30-11US
Price: 4.10 USD
Availability: InStock

Inicio Productos cojín la termal del silicón

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Datos del producto:

Lugar de origen:	Porcelana
Nombre de la marca:	Ziitek
Certificación:	UL & RoHS
Número de modelo:	TIF500-30-11US

Pago y Envío Términos:

Cantidad de orden mínima:	1000 Uds.
Precio:	0.1-10 USD/PCS
Detalles de empaquetado:	241312 cm de cartones
Tiempo de entrega:	3-5 días laborables
Condiciones de pago:	T/T
Capacidad de la fuente:	1000000 PC/mes

Contacto

Descripción detallada del producto

Nombre de los productos:	Almohadilla térmica de silicona de 3,0 W/MK de alto rendimiento con gran conductividad y aislamiento	Rango de espesor:	0,25~5,0 mm/(0,010~0,20 pulgadas)
Dureza:	20 orilla 00	Densidad:	3.1 g/cm3
Conductividad térmica:	3.0W/m-K	Color:	Gris oscuro
Palabras clave:	cojín termal del silicón	Solicitud:	CPU GPU AI y procesadores

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Products Description

TIF^®500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features:

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> RoHS compliant
> UL recognized

Applications:

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF^®500-30-11US Series
Property	Value		Test method
Color	Dark gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.5)	(0.75~5.0)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	6.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.0 W/m-K		ASTM D5470
	3.0 W/m-K		ISO22007

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors 0

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors 1

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

etiqueta: