logo
Inicio Productoscojín la termal del silicón

Dark Grey Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

Dark Grey Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

Datos del producto:
Lugar de origen: Porcelana
Nombre de la marca: Ziitek
Certificación: UL & RoHS
Número de modelo: TIF100-50-11US
Pago y Envío Términos:
Cantidad de orden mínima: 1000 piezas
Precio: 0.1-10 USD/PCS
Detalles de empaquetado: cajas de 24*13*12 cm
Tiempo de entrega: 3-5 días laborables
Condiciones de pago: T/T
Capacidad de la fuente: 1000000 PC/mes
Contacto
Descripción detallada del producto
Nombre de los productos: Almohadilla de relleno de huecos a base de silicona gris oscuro, materiales de almohadilla de huecos Espesor: 0.010 "(0.25 mm) ~ 0.200" (5.0 mm)
Color: Gris oscuro Peso específico: 3.2 g/cc
Voltaje de ruptura: VAC ≥ 5500 Palabras clave: Pad de separación térmica
Conductividad térmica: 5.0W/m-k Dureza: 65/20 Orilla 00
Solicitud: Procesadores de IA Servidores de IA Hogar inteligente Telecomunicaciones

Dark Grey Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom

 

The TIF®100-50-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Company Profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

 

Thermal graphite sheet/film

 

Thermal double-sided tape

 

Thermal insulation pad

 

Thermal grease

 

Phase change material

 

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL


Features


> Good thermal conductive: 5.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses


Applications

 

Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.

 

Typical Properties of TIF®100-50-11US Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 6.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0W/m-K ASTM D5470
5.0W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Dark Grey Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Contacto
Dongguan Ziitek Electronical Material and Technology Ltd.

Persona de Contacto: Dana Dai

Teléfono: +86 18153789196

Envíe su pregunta directamente a nosotros (0 / 3000)

Otros productos