Lugar de origen: | Porcelana |
Nombre de la marca: | Ziitek |
Certificación: | UL & RoHS |
Número de modelo: | Tif700res |
Cantidad de orden mínima: | 1000pcs |
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Precio: | 0.1-10 USD/PCS |
Detalles de empaquetado: | 24*13*12 cm de cartones |
Tiempo de entrega: | 3-5 días de trabajo |
Condiciones de pago: | T/T |
Capacidad de la fuente: | 1000000 PC/mes |
Nombre de los productos: | Alta temperatura de 8,5 W de rayos de silicona personalizados con almohadillas térmicas eléctricas p | Solicitud: | LED de CPU de GPU |
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Espesor: | 0.04 ~ 0.12 pulgadas / 1.0 ~ 3.0 mm | Peso específico: | 3.5G/CC |
Voltaje de descomposición dieléctrica: | > 5000 VAC | Conductividad térmica: | 8.5w/mk |
Color: | Gris | Temperatura operativa: | -40 ~ 200 ℃ |
Palabras clave: | Almohadillas térmicas de silicona | ||
Resaltar: | 8.5W/mK silicone thermal pad,GPU CPU thermal pad with warranty,high-performance thermal pad for LED |
High Temperature 8.5W Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led
Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product introduction
TIF®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Excellent thermal conductivity: 8.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
> Easy release construction
> Electrically isolating
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
> Display card
> Mainboard/mother board
> Notebook
> Power supply
Typical Properties of TIF®700RES Series | ||
Property | Value | Test method |
Color | Gray | Visual |
Construction &Compostion | Ceramic filled silicone elastomer | *** |
Thickness range | 0.04~0.12inch / 1.0~3.0mm | ASTM D374 |
Hardness | 10 Shore 00 | ASTM 2240 |
Specific Gravity | 3.5 g/cc | ASTM D792 |
Continuos Use Temp | -40 to 200℃ | Ziitek Test Method |
Dielectric Breakdown Voltage | ≥5000 VAC | ASTM D149 |
Dielectric Constant | 6.7 MHz | ASTM D150 |
Volume Resistivity | ≥1.0X1012Ohm-meter | ASTM D257 |
Fire rating | 94 V0 | UL E331100 |
Thermal conductivity | 8.5W/m-K | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Persona de Contacto: Dana Dai
Teléfono: +86 18153789196